激光切割機(jī)，雙平臺(tái)，大幅度提高生產(chǎn)效率，是專為FPC和PCB加工的設(shè)備。高效 FPC/PCB外形切割，鉆孔及覆蓋面開(kāi)窗，指紋識(shí)別芯片加工，TF內(nèi)存卡分板，手機(jī)攝像頭模組切割，二維碼的打碼等應(yīng)用，分塊，分層，指定塊或選擇區(qū)域切割并直接成型，切割邊緣整齊圓順，產(chǎn)品可以以矩形排列多個(gè)自動(dòng)定位切割，采用國(guó)際一線品牌的固態(tài)紫外線激光機(jī)。
Laser cutting machine, dual platform, greatly improve production efficiency, is specially for FPC and PCB processing equipment. High efficiency FPC / PCB shape cutting, drilling and covering surface windowing, fingerprint identification chip processing, TF memory card board division, mobile camera module cutting, two-dimensional code printing and other applications, block, layer, designated block or selected area cutting and direct molding, cutting edge is neat and smooth, products can be arranged in rectangular arrangement, multiple automatic positioning cutting, using solid-state ultraviolet excitation of international first-line brand Optical and mechanical.
高精度，低漂移的振鏡與快速的無(wú)鐵芯直接電機(jī)系統(tǒng)平臺(tái)組合，在快速切割同時(shí)保持微米量級(jí)的高精度，無(wú)需人工操作，操作簡(jiǎn)單，實(shí)現(xiàn)同類型一鍵式模式，大大提高生產(chǎn)效率。廢氣處理系統(tǒng)；吸風(fēng)系統(tǒng)可以將切割廢氣全部消除，避免了對(duì)操作人員的危害和對(duì)環(huán)境的污染。自動(dòng)化程度高；振鏡自動(dòng)校正，自動(dòng)調(diào)焦，全程實(shí)現(xiàn)自動(dòng)化，采用激光位移傳感器自動(dòng)調(diào)整焦點(diǎn)到臺(tái)面的高度，實(shí)現(xiàn)快速對(duì)接。功能強(qiáng)大的操作系統(tǒng)，簡(jiǎn)單方便。
High precision, low drift galvanometer combined with rapid coreless direct motor system platform can keep micron level high precision in fast cutting, without manual operation, easy to operate, realize the same type of one key mode, and greatly improve the production efficiency. Exhaust gas treatment system; suction system can eliminate all cutting waste gas, avoiding the harm to operators and environmental pollution. High degree of automation; galvanometer automatic correction, automatic focus, the whole process of automation, using laser displacement sensor to automatically adjust the height of focus to the table, to achieve rapid docking. Powerful operating system, simple and convenient。
| NO | 項(xiàng)目 Item | 技術(shù)參數(shù) technical parameter |
| 1 | 型號(hào) Model | YSV-6A |
| 2 | 主機(jī)尺寸 Host size | 1550mm*1550mm*1700mm |
| 3 | 激光機(jī)重量 Laser weight | 2000KG |
| 4 | 激光機(jī)供電電源 Laser power supply | AC220V/3.5KW |
| 5 | 激光源 Laser source | 紫外激光器UV Laser |
| 6 | 激光器 Laser | 美國(guó)光波 American Lightwave |
| 7 | 材料厚度 Material thickness | ≤1.2mm（視材料而定） |
| 8 | 掃描速度 Scanning speed | 1-900mm/ms |
| 9 | 整機(jī)精度 Overall accuracy | ±20μm |
| 10 | 平臺(tái)定位精度 Platform positioning accuracy | ±2μm |
| 11 | 平臺(tái)重復(fù)精度 Platform repeat accuracy | ±2μm |
| 12 | 切割幅度 Cutting range | 350mm*350mm/350mm(雙平臺(tái)) |
| 13 | 切縫寬度 Slit width | 20±5μm |
| 14 | 定位 Location | 自動(dòng)定位 Automatic positioning |
| 15 | 補(bǔ)償 compensate | 自動(dòng)補(bǔ)償漲縮 Automatic compensation for fluctuation |
| 16 | 聚焦光斑直徑 Focusing spot diameter | 20±5μm |
| 17 | 環(huán)境溫度/溫度 Ambient temperature / temperature | 20±2度/<60% |
| 18 | 振鏡掃描區(qū)域 Galvanometer scanning area | 50mm*50mm |
| 19 | 必要硬件和軟件 Necessary hardware and software | 含PC和CAM軟件 Including PC and CAM software |
| 20 | 速度 speed | X/Y軸最大空程速度（mm/s）800 Z軸最大空程速度（mm/s）150 |
| 21 | 工作平臺(tái) Working platform | 雙平臺(tái)切換 Dual platform switching |
| 22 | 粉塵處理 Dust treatment | 煙霧凈化處理系統(tǒng) Smoke purification system |
| 23 | 二維碼功能 QR code function | 打二維碼功能最小尺寸2MM X 2MM（自動(dòng)生成不重復(fù)） |
| 24 | 設(shè)備特殊性能 Special performance of equipment | 能夠達(dá)到無(wú)塵室環(huán)境使用要求 It can meet the requirements of clean room environment |
激光切割機(jī)，雙平臺(tái)，大幅度提高生產(chǎn)效率，是專為FPC和PCB加工的設(shè)備。高效 FPC/PCB外形切割，鉆孔及覆蓋面開(kāi)窗，指紋識(shí)別芯片加工，TF內(nèi)存卡分板，手機(jī)攝像頭模組切割，二維碼的打碼等應(yīng)用，分塊，分層，指定塊或選擇區(qū)域切割并直接成型，切割邊緣整齊圓順，產(chǎn)品可以以矩形排列多個(gè)自動(dòng)定位切割，采用國(guó)際一線品牌的固態(tài)紫外線激光機(jī)。
Laser cutting machine, dual platform, greatly improve production efficiency, is specially for FPC and PCB processing equipment. High efficiency FPC / PCB shape cutting, drilling and covering surface windowing, fingerprint identification chip processing, TF memory card board division, mobile camera module cutting, two-dimensional code printing and other applications, block, layer, designated block or selected area cutting and direct molding, cutting edge is neat and smooth, products can be arranged in rectangular arrangement, multiple automatic positioning cutting, using solid-state ultraviolet excitation of international first-line brand Optical and mechanical.
高精度，低漂移的振鏡與快速的無(wú)鐵芯直接電機(jī)系統(tǒng)平臺(tái)組合，在快速切割同時(shí)保持微米量級(jí)的高精度，無(wú)需人工操作，操作簡(jiǎn)單，實(shí)現(xiàn)同類型一鍵式模式，大大提高生產(chǎn)效率。廢氣處理系統(tǒng)；吸風(fēng)系統(tǒng)可以將切割廢氣全部消除，避免了對(duì)操作人員的危害和對(duì)環(huán)境的污染。自動(dòng)化程度高；振鏡自動(dòng)校正，自動(dòng)調(diào)焦，全程實(shí)現(xiàn)自動(dòng)化，采用激光位移傳感器自動(dòng)調(diào)整焦點(diǎn)到臺(tái)面的高度，實(shí)現(xiàn)快速對(duì)接。功能強(qiáng)大的操作系統(tǒng)，簡(jiǎn)單方便。
High precision, low drift galvanometer combined with rapid coreless direct motor system platform can keep micron level high precision in fast cutting, without manual operation, easy to operate, realize the same type of one key mode, and greatly improve the production efficiency. Exhaust gas treatment system; suction system can eliminate all cutting waste gas, avoiding the harm to operators and environmental pollution. High degree of automation; galvanometer automatic correction, automatic focus, the whole process of automation, using laser displacement sensor to automatically adjust the height of focus to the table, to achieve rapid docking. Powerful operating system, simple and convenient。
| NO | 項(xiàng)目 Item | 技術(shù)參數(shù) technical parameter |
| 1 | 型號(hào) Model | YSV-6A |
| 2 | 主機(jī)尺寸 Host size | 1550mm*1550mm*1700mm |
| 3 | 激光機(jī)重量 Laser weight | 2000KG |
| 4 | 激光機(jī)供電電源 Laser power supply | AC220V/3.5KW |
| 5 | 激光源 Laser source | 紫外激光器UV Laser |
| 6 | 激光器 Laser | 美國(guó)光波 American Lightwave |
| 7 | 材料厚度 Material thickness | ≤1.2mm（視材料而定） |
| 8 | 掃描速度 Scanning speed | 1-900mm/ms |
| 9 | 整機(jī)精度 Overall accuracy | ±20μm |
| 10 | 平臺(tái)定位精度 Platform positioning accuracy | ±2μm |
| 11 | 平臺(tái)重復(fù)精度 Platform repeat accuracy | ±2μm |
| 12 | 切割幅度 Cutting range | 350mm*350mm/350mm(雙平臺(tái)) |
| 13 | 切縫寬度 Slit width | 20±5μm |
| 14 | 定位 Location | 自動(dòng)定位 Automatic positioning |
| 15 | 補(bǔ)償 compensate | 自動(dòng)補(bǔ)償漲縮 Automatic compensation for fluctuation |
| 16 | 聚焦光斑直徑 Focusing spot diameter | 20±5μm |
| 17 | 環(huán)境溫度/溫度 Ambient temperature / temperature | 20±2度/<60% |
| 18 | 振鏡掃描區(qū)域 Galvanometer scanning area | 50mm*50mm |
| 19 | 必要硬件和軟件 Necessary hardware and software | 含PC和CAM軟件 Including PC and CAM software |
| 20 | 速度 speed | X/Y軸最大空程速度（mm/s）800 Z軸最大空程速度（mm/s）150 |
| 21 | 工作平臺(tái) Working platform | 雙平臺(tái)切換 Dual platform switching |
| 22 | 粉塵處理 Dust treatment | 煙霧凈化處理系統(tǒng) Smoke purification system |
| 23 | 二維碼功能 QR code function | 打二維碼功能最小尺寸2MM X 2MM（自動(dòng)生成不重復(fù)） |
| 24 | 設(shè)備特殊性能 Special performance of equipment | 能夠達(dá)到無(wú)塵室環(huán)境使用要求 It can meet the requirements of clean room environment |
